The Exynos 2400 has reportedly been authorized for full manufacturing, with samples expected to be delivered by June 2023, according to a rumor from the South Korean tech site Meeco. It will be the largest chip Samsung has ever produced, and TM Roh is keenly watching it.
Even though Qualcomm implied that its silicon will initially only power Samsung’s flagship handsets, rumors of a next-generation Exynos flagship chip have persisted, mostly in tech forums like Meeco. For instance, a prior report said Exynos 2400 chipsets would be used in local (South Korean) Galaxy S24 models. As previously indicated, a recent post on the forum claims that the SoC has been approved for mass manufacturing. It is important to clarify that the “Dream Team” SoC referred to in earlier publications is not the Exynos 2400. The latter is an initiative led by Samsung’s recently established MX business.
The Exynos 2400 will be shipped to Samsung Electronics anytime between April and June, and Samsung’s TM Roh is said to be closely monitoring it. The SoC and 12 GB of RAM will reportedly be used in the base Galaxy S24. However, the details of its CPU are unknown; one leaker claims it will have a 10-core, quad-cluster architecture, while another claims it will have an 8-core, tri-cluster architecture.
The Exynos 2400’s die size will also be greatly expanded by Samsung, presumably to make room for its ten CPU cores, GPU, and other components. It is said to be 30% larger than the Exynos 990, making it 130 mm2, almost as large as the Apple M1. The primary Cortex-X4 core must be underclocked in the initial samples of the chip, but that will probably alter in the future. Little is known about the fabrication method that the Exynos 2400 will employ. It is now believed to be Samsung’s 4LPP+ process.
