Semiconductor device fabrication refers to the process of producing semiconductor devices, which are typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) found in everyday electrical and electronic devices. The process of creating electronic devices using semiconductor materials such as silicon, is also known as semiconductor manufacturing or semiconductor processing. These devices, which include integrated circuits (ICs), microprocessors, memory chips, and various other electronic components, serve as the foundation of modern electronic systems.
It is a multi-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion implantation, and etching) that gradually creates electronic circuits on a wafer made of pure single-crystal semiconducting material. Silicon is almost always used, but for specialized applications, various compound semiconductors are used.
The fabrication process involves several steps, which I’ll outline below:
(a) Design: The design of the semiconductor device, which includes the layout and functionality of the electronic components, is the first step in the process. Designers create the circuit layout using computer-aided design (CAD) tools, optimizing it for performance, power consumption, and manufacturability.
(b) Deposition: Thin films of various materials are deposited onto the substrate using techniques such as chemical vapor deposition (CVD) or physical vapor deposition (PVD), such as silicon dioxide (SiO2) or metal layers. These films serve as the foundation for the device’s various layers and components.
(c) Lithography: Lithography is a critical step in the process that involves transferring the device’s circuit pattern onto the substrate. After applying a photosensitive material called a resist to the substrate, a mask with the desired circuit pattern is used to expose the resist to light. The light exposure causes chemical changes in the resist, allowing the pattern to be etched onto the substrate.
(d) Etching: Etching uses chemical or plasma-based processes to remove unwanted portions of thin films from the substrate. The etching process removes material selectively according to the patterned resist, resulting in the desired circuit structures.
(e) Doping: Doping is the process of introducing impurities into specific regions of the substrate to modify its electrical properties. Different types of impurities are added to create either n-type or p-type regions, forming transistors, diodes, and other components.
(f) Metallization: Metal layers, typically aluminum or copper, are deposited onto the substrate to interconnect the various components of the device. These metal layers form the wiring or interconnects that allow signals to flow between different parts of the device.
(g) Final Testing and Quality Assurance: The packaged devices undergo final testing to verify their functionality and quality. Various electrical tests are performed to ensure that the devices meet the specified requirements.
